Features: high strength raw materials, uniform particle size distribution, particles into a sharp shape, angular, polygonal, blocky particles

　　It is suitable for wire cutting of gem, sapphire, quartz chip, led sapphire substrate, liquid crystal glass, high precision magnetic materials, and also suitable for cutting, grinding and polishing of organic and inorganic brittle materials. Such as: wire saw, rope saw, gem saw blade, semiconductor saw blade and other cutting tools.